Thermal solutions for your PCBs

Thermal simulation - Optimized heat dissipation in printed circuit boards

How do you prevent thermal overloads in your PCBs? Our simulations provide the answers!

With our expertise in thermal simulations, we can make your development decisions easier and your products more reliable. In our most recent projects, we have carried out comprehensive parameter investigations in order to optimize heat dissipation and better protect components. ZFW has access to the latest methods and software options for this purpose.

• Heat dissipation designs: optimized layout, cooling domes and thermal vias.
• Hotspot analysis: localization and reduction of thermal peaks.
• Operating temperatures: ensuring stable and safe temperature ranges.
• Thermally conductive pastes and thermal pads: For more efficient heat transfer between components and PCBs.
• Thermal contacts: Improved connections between components and heat sinks.
• Material selection and layer structure: Use of materials with high thermal conductivity.

Would you also like to optimize your designs? Together we will develop innovative solutions that are perfectly tailored to your requirements.

Get in touch!