T3ster

T3ster®

Thermal transient method


In the thermal transient method, individual thermal resistances and contact resistances are broken down from the heat source to the heat sink. Assuming a one-dimensional heat path and a known interconnection of the thermal resistances, these can be determined. The assembly to be characterized has an electrical jump function
applied. The resulting step response is generated via a thermally sensitive
Parameters such as the forward voltage are measured. By means of calibration in advance,
calculate the thermal response from the electrical step response.

The T3ster method is mainly used to quickly evaluate the thermal properties of IC packages (chip housings), power semiconductors, LEDs and systems. However, materials and layer systems can also be examined in which a one-dimensional heat path through the material can be made possible. For example, heat transfers between individual layers can be characterized in the form of contact resistances.
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