ZFW Academy

In addition to product-specific advice, we also offer training courses on all aspects of thermal management as part of the ZFW Academy. Therefore, we regularly organize in-house training courses and seminars for companies to train in the field of cooling and heat management. In addition to our own in-house training courses, we also frequently give lectures at various training institutions.

Further training modules at university level for practical use

We offer further training in the areas

• Thermal management in electronics
• Basics and selected topics of mechatronics

The concept:

• Due to our close connection to the Baden-Wuerttemberg Cooperative State University, Faculty of Technology, the modules are based on the lecture content of the university.
• The modules can be booked individually. Or we can put together a complete package for your company that is tailored to your requirements.
• Our lecturers have teaching experience at universities and also have a lot of practical experience.
• The events take place mainly online. We use complex transmission technology with several cameras for online transmission.

Language: English

These modules will be offered in 2024 on the following dates:

Module 1: Physical principles

Physical basics: heat transport through heat conduction, convection and heat radiation. Thermal contact resistance, heat spread. Simple basic equations for rough calculations. Illustrating the theory with practical examples.

Module 2: Overview of Cooling Strategies in Electronics

Heat dissipation on package, substrate and system level, passive heat dissipation through spreading effect, definition of Rth values, Zth and pulse Zth curve, meaning in practice, typical packages and their heat paths, printed circuit boards (standard, flex, semi-flex, Microvia and inlay technology, thick copper, special solutions), evaluation of heat paths from the junction to the environment.

Module 6: Thermal interface materials 1

Thermally conductive pastes, thermally conductive adhesives, gels, PCM, PADs and foils, selection criteria,

Aging behavior and failure mechanisms, operating temperature and reliability.

Module 7: Thermal interface materials 2 - test methods

Power cycling, temperature change test, vibration test, electrical test, thermal analysis in the event of shear (battery swelling application), standards and experience

from practice

Module 12: Temperature measurement technology

Thermocouples, resistance thermometers and thermal imaging cameras.
Correct attachment of temperature sensors, errors due to heat dissipation, dynamic behavior, typical measurement errors with thermal imaging cameras, influence of the emissivity, measurement errors due to interference radiation. Live demonstrations (also online).

Module 9: Thermal Analysis Methods

Methods for thermal analysis of heat paths in electronic systems: Measurement of temperature and thermal conductivity using the laser flash method, the stationary cylinder method according to ASTM D5470, the hot wire method (and modifications thereof). Analysis with the thermal transient method. Difference in thermal conductivity/effective thermal conductivity. Comparison of the methods and comparability of the measurement results, possibilities and limitations, common errors in practical application.

Module 8: Thermal and rheological properties of filled polymers

Overview of matrix materials, fillers and property profiles. Overview of thermal and rheological parameters, thermal and rheological properties of filled polymers, influences of filler material, particle shape, particle size and distribution, degree of filling, surface functionalization, material mixing, measurement and calculation methods Examples: housing components, thermal interface materials.